000 01233camaa2200325 a 4500
999 _c2815
_d2815
001 UUL-039309
003 BD-DhUUL
005 20190425135508.0
008 190425s2004 nyua grb 001 0 eng d
010 _a 2004043361
020 _a0471460508
040 _aBD-DhUUL
_cBD-DhUUL
_dDLC
042 _apcc
050 0 0 _aTK7868.P7
_bL578 2004
082 0 0 _a621.381531
_222
100 1 _aLiu, Weifeng.
_94298
245 1 0 _aIC component sockets /
_cWeifeng Liu.
260 _aHoboken, NJ. :
_bWiley-Interscience,
_cc2004.
300 _axii, 219 p. :
_bill. ;
_c24 cm.
504 _aIncludes bibliographical references and index.
650 0 _aPrinted circuits
_xEquipment and supplies.
_94299
650 0 _aElectric connectors.
_94300
650 0 _aMicroelectronic packaging.
_94301
700 1 _aPecht, Michael.
_94302
856 4 1 _3Table of contents
_uhttp://www.loc.gov/catdir/toc/wiley041/2004043361.html
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/bios/wiley046/2004043361.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/description/wiley041/2004043361.html
856 4 2 _3Book review (E-STREAMS)
_uhttp://www.e-streams.com/es0806_7/es0867_4168.html
942 _2ddc
_cBK